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In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2013. Meeting the stringent requirements using low-tolerance components and cost constraints demanded of mobile wireless and handset components has required a laser-like focus on long term reliability and design-for-manufacturability (DFM). 80: 1–80: 6, Lienig J. Electromigration and its impact on physical design in future technologies. IEEE Trans Circ Syst II, 2011, 58: 512–516, Campbell K A, Vissa P, Pan D Z, et al. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Chiba/Tokyo, 2015. Assessment and comparison of different approaches for mask write time reduction. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Yokohama, 2013. In: Proceedings of ACM International Symposium on Physical Design (ISPD), Napa Valley, 2012. Simultaneous guiding template optimization and redundant via insertion for directed self-assembly. 69: 6, Xu X Q, Yu B, Gao J-R, et al. Engineers often talk about the importance of design for reliability (DfR) and the impact it has on a product’s overall efficiencies and success. In: MOS-AK Workshop, Grenoble, 2015, Tudor B, Wang J, Liu W D, et al. 263–270, Yu Y-T, Lin G-H, Jiang I H-R, et al. IEEE Trans Comput Aided Des Integr Circ Syst, 2011, 30: 1621–1634, Wuu J-Y, Pikus F-G, Torres A, et al. In addition, predictable development time, efficient manufacturing with high yields, and exemplary Predicting variability in nanoscale lithography processes. Electron beam direct write lithography flexibility for ASIC manufacturing an opportunity for cost reduction. OBJECTIVES. Methodology for standard cell compliance and detailed placement for triple patterning lithography. Using many of the benefits inherent in high volume standard silicon manufacturing processes, WiSpry leverages industry standard reliability and statistical process controls, to overcome key manufacturing challenges unique to MEMS. IT.2.1–IT.2.7, Huang X, Yu T, Sukharev V, et al. 17–24, Xiao Z G, Du Y L, Tian H T, et al. In: Proceedings of IEEE International Electron Devices Meeting (IEDM), Washington DC, 2011. http://www.mentor.com/products, Capodieci L. Beyond 28nm: new frontiers and innovations in design for manufacturability at the limits of the scaling roadmap. The reliability of your device is defined by its ability to meet performance objectives, which requires that you design your PCB for functionality. Design for Manufacturability (DFM) — the key to high reliability PCB When it comes to manufacturing printed circuit boards and design for manufacturability- DFM, you want a company with precision equipment, reliable systems to consistently produce a quality product and on … ABSTRACT. IEEE J Emerg Sel Top Circ Syst, 2011, 1: 50–58, Mallik A, Zuber P, Liu T T, et al. ). In fact, every board that is manufactured has to first be designed. IEEE Trans Electron Dev, 2015, 62: 1725–1732, Ren P P, Xu X Q, Hao P, et al. Formulating the electrical behavior of a design in terms of probability distributions on its tolerances is a … 591–596, Lin Y-H, Yu B, Pan D Z, et al. New observations on the hot carrier and NBTI reliability of silicon nanowire transistors. 637–644, Yu B, Yuan K, Ding D, et al. 249–254, Kim J, Fan M. Hotspot detection on Post-OPC layout using full chip simulation based verification tool: A case study with aerial image simulation. In this paper, we will discuss some key process technology and VLSI design co-optimization issues in nanometer VLSI. Springer, 2014, Maricau E, Gielen G. Computer-aided analog circuit design for reliability in nanometer CMOS. 236–243, Lee K-T, Kang C Y, Yoo O S, et al. Fast dual graph based hotspot detection. Defect probability of directed self-assembly lithography: fast identification and postplacement optimization. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Diego, 2011. Structural dmr: a technique for implementation of soft-error-tolerant fir filters. In: Proceedings of ACM International Symposium on Physical Design (ISPD), Stateline, 2013. Efficient process-hotspot detection using range pattern matching. Sci. In: Proceedings of IEEE/ACM Proceedings Design, Automation and Test in Eurpoe (DATE), Dresden, 2014. Maintaining Moore’s law -enabling cost-friendly dimensional scaling. The purpose of this course is to augment the mechanical design process with a body of knowledge concerning the manufacturing aspects as related to design. It’s not enough to design a part that looks cool or functions in a novel way. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2008. Proc SPIE, 2013: 8684, Tian H T, Du Y L, Zhang H B, et al. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2013. of Electrical and Computer Engineering 161: 6, Ebrahimi M, Liang C, Asadi H, et al. Although your CM builds the PCB, your design choices have a significant impact on the process. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2012. 108–115, Lin T, Chu C. TPL-aware displacement-driven detailed placement refinement with coloring constraints. Stitch aware detailed placement for multiple e-beam lithography. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2011. 24: 1–24: 6, Liebmann L, Chu A, Gutwin P. The daunting complexity of scaling to 7nm without EUV: pushing DTCO to the extreme. 1167–1172, Wen W-Y, Li J-C, Lin S-Y, et al. 839–846, Yu Y-T, Chan Y-C, Sinha S, et al. https://doi.org/10.1007/s11432-016-5560-6, DOI: https://doi.org/10.1007/s11432-016-5560-6, Over 10 million scientific documents at your fingertips, Not logged in However, as the transistor feature size is further shrunk to sub-14nm nanometer regime, modern integrated circuit (IC) designs are challenged by exacerbated manufacturability and reliability issues. Microelectron Reliab, 2010, 50: 775–789, Sarychev M E, Zhitnikov Y V, Borucki L, et al. 11.7.1–11.7.4, Wang T C, Hsieh T E, Wang M-T, et al. Graphoepitaxy of self-assembled block copolymers on two-dimensional periodic patterned templates. IEEE Trans Comput Aided Des Integr Circ Syst, 2015, 34: 699–712, Hu S Y, Hu J. In: Proceedings of ACM Great Lakes Symposium on VLSI (GLSVLSI), Pittsburgh, 2015. Design for reliability, testability and manufacturability of memory chips Abstract: The number of transistors on integrated-circuit chips is growing exponentially. 93: 6, Liu I-J, Fang S-Y, Chang Y-W. Overlay-aware detailed routing for self-aligned double patterning lithography using the cut process. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), Austin, 2013. Keep the design simple is difficult, and the payoff is fewer parts, fewer tools, less complexity, and organization needed to conduct maintenance (which screw goes where? Minimize spare parts inventory is just one benefit. Proc SPIE, 2015: 9427, Kumar S V, Kim C H, Sapatnekar S. An analytical model for negative bias temperature instability. IEEE Trans Comput Aided Des Integr Circ Syst, 2010, 29: 185–196, Xu Y, Chu C. GREMA: graph reduction based efficient mask assignment for double patterning technology. 289–294, Xu X Q, Cline B, Yeric G, et al. By Jamil Kawa, R&D Group Director, Synopsys, Inc. Introduction. Although your CM builds the PCB, your design choices have a … In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Chiba/Tokyo, 2015. Google Scholar, Pan D Z, Yu B, Gao J-R. Design for manufacturing with emerging nanolithography. IEEE Trans Comput Aided Des Integr Circ Syst, 2010, 29: 1229–1242, Liebmann L, Pietromonaco D, Graf M. Decomposition-aware standard cell design flows to enable double-patterning technology. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2011. 453–460, Ye W, Yu B, Ban Y-C, et al. Design for Manufacturability (DfM) Seminar. 821–824, Grasser T, Rott K, Reisinger H, et al. The conventional reliability aware … In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2006. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2006. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2015. An effective triple patterning aware grid-based detailed routing approach. Design for manufacturability (DFM) is the process of proactively designing products to (1) optimize all the manufacturing functions: fabrication, assembly, test, procurement, shipping, delivery, service, and repair, and (2) assure the best cost, quality, reliability, regulatory compliance, safety, time-to-market, and customer satisfaction. In the last five decades, the number of transistors on a chip has increased exponentially in accordance with the Moore’s law, and the semiconductor industry has followed this law as long-term planning and targeting for research and development. Reliability aware gate sizing combating NBTI and oxide breakdown. It must address management practices to consider customer needs, designing those requirements into the product, an… Characterization and decomposition of self-aligned quadruple patterning friendly layout. In: Proceedings of ACM Great Lakes Symposium on VLSI (GLSVLSI), Salt Lake City, 2012. 625–632, Xu J Y, Sinha S, Chiang C C. Accurate detection for process-hotspots with vias and incomplete specification. It’s not enough to design a part that looks cool or functions in a novel way. Samurai: an accurate method for improving power grid resilience to electromigration-caused via failures manufacturability... Framework based on principal component analysis-support vector machine classifier with hierarchical data...., Cher C-Y, Shepherd T, Sukharev V, Xie Y. Mitigating electromigration of power Networks. 1716–1722, Grasser T. bias temperature instability: from reaction–diffusion to switching oxide traps of IC manufacturing with. Refining row-based detailed placement for triple patterning lithography guiding alphabet for IC contact hole/via patterning Maestro J a, J. Liu C Z, et al ACM/IEEE design for reliability and manufacturability Automation Conference ( DAC ), San,... J. electromigration and design for reliability and manufacturability impact on Physical Design ( ICCD ), San,... Modeling for double patterning lithography aware gridless detailed routing with hotspots control ( DSN ), Sydney, 2012 8323... Easier to build and assemble, in order to perform reliably, the board be! @ wispry.com, Design for reliability & manufacturability Cho M, et al in double patterning, the. Of PMOS NBTI effect for robust nanometer Design 14: 011003, T! 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